In Situ TEM Atomic Force Microscopy" />
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    MEMS Sensor for In Situ TEM Atomic Force Microscopy

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    Here, we present a MEMS atomic force microscope sensor for use inside a transmission electron microscope ITEM). This enables direct in situ TEM force measurements in the nanonewton range and thus mechanical characterization of nanosized structures. The main design challenges of the system and sensor are to reach a high sensitivity and to make a compact design that allows the sensor to be fitted in the narrow dimensions of the pole gap inside the TEM. In order to miniaturize the sensing device, an integrated detection with piezoresistive elements arranged in a full Wheatstone bridge was used. Fabrication of the sensor was done using standard micromachining techniques, such as ion implantation, oxide growth and deep reactive ion etch. We also present in situ TEM force measurements on nanotubes, which demonstrate the ability to measure spring constants of nanoscale systems.

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    Description

    Title : MEMS Sensor for In Situ TEM Atomic Force Microscopy
    Author(s) : A. Nafari, D. Karlen, C. Rusu, K. Svensson, H. Olin, P. Enoksson
    Abstract : Here, we present a MEMS atomic force microscope sensor for use inside a transmission electron microscope ITEM). This enables direct in situ TEM force measurements in the nanonewton range and thus mechanical characterization of nanosized structures. The main design challenges of the system and sensor are to reach a high sensitivity and to make a compact design that allows the sensor to be fitted in the narrow dimensions of the pole gap inside the TEM. In order to miniaturize the sensing device, an integrated detection with piezoresistive elements arranged in a full Wheatstone bridge was used. Fabrication of the sensor was done using standard micromachining techniques, such as ion implantation, oxide growth and deep reactive ion etch. We also present in situ TEM force measurements on nanotubes, which demonstrate the ability to measure spring constants of nanoscale systems.
    Subject : unspecified
    Area : Other
    Language : English
    Year : 2008

    Affiliations Mid Sweden University
    Journal : Journal of Microelectromechanical Systems
    Volume : 17
    Issue : 2
    Publisher : Ieee
    Pages : 328 - 333
    Url : http://ieeexplore.ieee.org/lpdocs/epic03/wrapper.htm?arnumber=4446608
    Doi : 10.1109/JMEMS.2007.912714

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